Residual Stress Development during Laminate Processing

Residual Stress Development during Laminate Processing

Author(s):

Theriault P. R. ( University of Wisconsin-Madison )
Osswald A. T. ( University of Wisconsin-Madison )
Castro M. J. ( AlliedSignal Laminate Systems Inc. )

Publication title:

Conference proceedings at ANTEC '98 : plastics on my mind, Society of Plastics Engineers, Atlanta, Georgia, April 26-April 30, 1998

Title of ser.:

Annual Technical Conference - ANTEC : Society of Plastics Engineers Annual Technical Papers

Ser. no.:

44(1)

Pub. Year:

1998

Vol.:

1

Page(from):

758

Page(to):

762

Pages:

5

Pub. info.:

Brookfield Center, CT: Society of Plastics Engineers, Inc. (SPE)

ISBN:

9781566766692 [1566766699]

Language:

English

Call no.:

S42700/44-1

Type:

Conference Proceedings

Details

TDL ID:	ZA00018301
Series ID:	PA00000030
Conf. info. (Name):	ANTEC '98 : Annual Technical Conference
Conf. info. (Number):	56th
Conf. info. (Venue):	Atlanta, GA, USA
Conf. info. (Date):	1998.04.26-1998.04.30
Note for article:	THERMOSET DIVISION

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