Failure analysis of wafer-level reliability testing failure
- Author(s):
Oh,C.K. ( Chartered Semiconductor Manufacturing Ltd. ) Neo,S.P. Bi,J.H. Wu,Z.M. Goh,L.C. Redkar,S. - Publication title:
- In-Line Methods and Monitors for Process and Yield Improvement
- Title of ser.:
- Proceedings of SPIE - the International Society for Optical Engineering
- Ser. no.:
- 3884
- Pub. Year:
- 1999
- Page(from):
- 228
- Page(to):
- 235
- Pub. info.:
- Bellingham, Wash.: SPIE - The International Society for Optical Engineering
- ISSN:
- 0277786X
- ISBN:
- 9780819434814 [0819434817]
- Language:
- English
- Call no.:
- P63600/3884
- Type:
- Conference Proceedings
Similar Items:
SPIE-The International Society for Optical Engineering |
SPIE-The International Society for Optical Engineering |
2
Conference Proceedings
Failure Analysis and Investigation of Bondpad Peeling Problem during Bonding
Electrochemical Society |
8
Conference Proceedings
Study on Minimum Propagation Current of Bi-2223/Ag Superconducting Multifilament Tape
Trans Tech Publications |
IMAPS |
Trans Tech Publications |
4
Conference Proceedings
On the reliability and failure of PBGA Interconnects under Bending Cyclic Test
IMAPS |
Society of Photo-optical Instrumentation Engineers |
SPIE - The International Society for Optical Engineering |
11
Conference Proceedings
Reliability Studies of Cu Using Wafer Level Joule Heated Electromigration Test
MRS - Materials Research Society |
SPIE-The International Society for Optical Engineering |
12
Conference Proceedings
In-line failure analysis on productive wafers with dual-beam SEM/FIB systems
SPIE-The International Society for Optical Engineering |