Film stress changes during anodic bonding of NGL masks
- Author(s):
- Cotte,E.P. ( Univ.of Wisconsin/Madison )
- Schlax,M.P.
- Engelstad,R.L.
- Lovell,E.G.
- Brooks,C.J.
- Publication title:
- Emerging lithographic technologies IV : 28 February-1 March 2000, Santa Clara, USA
- Title of ser.:
- Proceedings of SPIE - the International Society for Optical Engineering
- Ser. no.:
- 3997
- Pub. Year:
- 2000
- Page(from):
- 515
- Page(to):
- 524
- Pub. info.:
- Bellingham, Wash.: SPIE - The International Society for Optical Engineering
- ISSN:
- 0277786X
- ISBN:
- 9780819436153 [0819436151]
- Language:
- English
- Call no.:
- P63600/3997
- Type:
- Conference Proceedings
Similar Items:
1
Conference Proceedings
Comparison of substrate curvature and resonant frequency thin film stress mapping techniques
SPIE - The International Society for Optical Engineering |
SPIE-The International Society for Optical Engineering |
SPIE - The International Society for Optical Engineering |
8
Conference Proceedings
Mask-related distortions of modified fused silica reticles for 157-nm lithography
SPIE-The International Society for Optical Engineering |
SPIE - The International Society for Optical Engineering |
SPIE - The International Society for Optical Engineering |
SPIE - The International Society for Optical Engineering |
10
Conference Proceedings
Experimental model verification of the thermal response of optical reticles
SPIE-The International Society for Optical Engineering |
5
Conference Proceedings
Dynamic characterization of step-induced vibrations of x-ray mask membranes
SPIE-The International Society for Optical Engineering |
Society for Experimental Mechanics |
6
Conference Proceedings
Modal analysis of the SCALPEL mask using experimental and numerical methods
SPIE - The International Society for Optical Engineering |
SPIE - The International Society of Optical Engineering |