THE ADHESION AND THE PROTECTION OF METALLIC IMPURITIES AT THE INTERFACE OF Si WAFER SURFACE WITH ANION SPECIES

THE ADHESION AND THE PROTECTION OF METALLIC IMPURITIES AT THE INTERFACE OF Si WAFER SURFACE WITH ANION SPECIES

Author(s):

Publication title:

Surface chemical cleaning and passivation for semiconductor processing

Title of ser.:

Materials Research Society symposium proceedings

Ser. no.:

315

Pub. Year:

1993

Page(from):

333

Pub. info.:

Pittsburgh, PA: MRS - Materials Research Society

ISSN:

02729172

ISBN:

9781558992139 [1558992138]

Language:

English

Call no.:

M23500/315

Type:

Conference Proceedings

Details

TDL ID:	ZA00018004
Series ID:	PA00000011
Conf. info. (Name):	Symposium on surface chemical cleaning and passivation for semiconductor processing ; Materials Research Society Spring Meeting
Conf. info. (Number):	1993
Conf. info. (Venue):	San Francisco, California, USA
Conf. info. (Date):	1993.04.13-1993.04.15

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