Compatibility of Adhesives with Thermoplastic Regrind
- Author(s):
- Sivy, G. T. ( ITW Adhesive Systems )
- Publication title:
- Back to the future : conference proceedings : ANTEC 1992, Detroit, May 3-7
- Title of ser.:
- Annual Technical Conference - ANTEC : Society of Plastics Engineers Annual Technical Papers
- Ser. no.:
- 38
- Pub. Year:
- 1992
- Pt.:
- 1
- Page(from):
- 1561
- Page(to):
- 1565
- Pages:
- 5
- Pub. info.:
- Brookfield Center, CT: Society of Plastics Engineers, Inc. (SPE)
- Language:
- English
- Call no.:
- S42700/921583
- Type:
- Conference Proceedings
Similar Items:
|
1
Technical Paper
REDUCTION OF MOISTURE EFFECTS DURING THE CURE OF EPOXY ADHESIVES USED IN COMPOSITE REPAIR
National Aeronautics and Space Administration |
7
Conference Proceedings
The Consequence on Structural Adhesive Bonding of Humid Thermoplastic Composites and Possibilities of Prevention
Trans Tech Publications |
|
2
Conference Proceedings
An Analysis of Pre-Consumer Regrind in an Injection Molded Thermoplastic Part
Society of Plastics Engineers, Inc. (SPE) |
Trans Tech Publications |
|
Society of Plastics Engineers, Inc. (SPE) |
Society of Plastics Engineers, Inc. (SPE) |
|
Society of Plastics Engineers, Inc. (SPE) |
10
Conference Proceedings
Effect of Regrind on the Electrical and Physical Properties of a Thermoplastic Resin with NCG Fibers
Society of Plastics Engineers, Inc. (SPE) |
|
Society of Plastics Engineers, Inc. (SPE) |
11
Conference Proceedings
Non-Ferrous Metal Separator Applications in Pre- and Post-Consumer Thermoplastic Regrind
Society of Plastics Engineers, Inc. (SPE) |
|
6
Conference Proceedings
STRESS-FREE THERMOPLASTIC ADHESIVES FOR HIGH RELIABILITY MICROELECTRONICS APPLICATIONS
SPIE-The International Society for Optical Engineering |
Society of Plastics Engineers, Inc. (SPE) |