Blank Cover Image

Algorithmic and practical questions of electrothermal circuit simulation

Author(s):
Publication title:
Design, characterization, and packaging for MEMS and microelectronics : 27-29 October 1999, Royal Pines Resort, Queensland, Australia
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
3893
Pub. Year:
1999
Page(from):
178
Page(to):
187
Pub. info.:
Bellingham, Wash.: SPIE - The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819434944 [0819434949]
Language:
English
Call no.:
P63600/3893
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings Integration of a network solver and a field solver for the mixed level thermal simulation of MEMS problems

Rencz, M., Szekely, V., Poppe, A.

SPIE-The International Society for Optical Engineering
7 Conference Proceedings Compact dynamic thermal multiport models of packages for MEMS-package cosimulation

Rencz,M., Szekely,V.

SPIE-The International Society for Optical Engineering
2 Conference Proceedings SUNRED:a new field solving approach

Szekely,V., Pahi,A., Rencz,M.

SPIE - The International Society for Optical Engineering
8 Conference Proceedings Algorithmic solutions for thermal and electrostatic simulation of MEMS (Invited Paper)

Szekely, V.

SPIE-The International Society for Optical Engineering
3 Conference Proceedings From MEMS to the global simulation of SoCs

Rencz,M., Szekely,V., Poppe,A., Courtois,B.

SPIE-The International Society for Optical Engineering
9 Conference Proceedings CAD framework concept for the design of integrated microsystems

Poppe,A., Rencz,M., Szekely,V., Karam,J.-M., Courtois,B., Hofmann,K., Glesner,M.

SPIE-The International Society for Optical Engineering
4 Conference Proceedings THERMODEL:a tool for thermal model generation and application for MEMS packages

Szekely,V., Rencz,M., Poppe,A., Courtois,B.

SPIE - The International Society for Optical Engineering
10 Conference Proceedings New Tools and Methods for the Thermal Transient Testing of Packages

Rencz,Marta, Farkas,G., Szekely,Vladimir, Poppe,A., Courtois,Bernard

SPIE-The International Society for Optical Engineering
5 Conference Proceedings ｦﾌS-THERMANAL:an efficient thermal simulation tool for microsystem elements and MCMs

Szekely,V., Csendes,A., Rencz,M.

SPIE-The International Society for Optical Engineering
11 Conference Proceedings Tool and method for the theremal transient evaluation of packages

Szekely,V., Rencz,M., Courtois,B.

SPIE - The International Society for Optical Engineering
6 Conference Proceedings Microsystem design framework based on tool adaptations and library developments

Karam,J.-M., Courtois,B., Rencz,M., Poppe,A., Szekely,V.

SPIE-The International Society for Optical Engineering
12 Conference Proceedings Engineering tool set for monolithic and hybrid microsystem design

Boutamine,H., Karam,J.M., Courtois,B., Drake,P., Oudinot,J., El Tahawi,H., Cao,A., Rencz,M., Poppe,A., Szekely,V.

SPIE-The International Society for Optical Engineering
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12