Novel metallization scheme using nitrogen passivated Ti liner for AlCu-based metallization

Novel metallization scheme using nitrogen passivated Ti liner for AlCu-based metallization

Author(s):

Schmidbauer,S. ( Infineon Technologies AG )
Spinler,S.
Lehr,M.U.
Klotzsche,J.
Hahn,J.

Publication title:

Multilevel Interconnect Technology III

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

3883

Pub. Year:

1999

Page(from):

148

Page(to):

158

Pub. info.:

Bellingham, Wash.: SPIE - The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819434807 [0819434809]

Language:

English

Call no.:

P63600/3883

Type:

Conference Proceedings

Details

TDL ID:	ZA00017633
Series ID:	PA00000029
Conf. info. (Name):	Microelectronic Manufacturing : Multilevel Interconnect Technology
Conf. info. (Number):	1999 : 3rd
Conf. info. (Venue):	Santa Clara, CA, USA
Conf. info. (Date):	1999.09.22-1999.09.23

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