Lithography performance of contact holes:II.Simulation of effects of reticle corner rounding on wafer print performance

Lithography performance of contact holes:II.Simulation of effects of reticle corner rounding on wafer print performance

Author(s):

Mack,C.A. ( FINLE Technologies,Inc. )
Sauer,C.A.
Chabala,J.M.

Publication title:

Photomask and Next-Generation Lithography Mask Technology VII

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

4066

Pub. Year:

2000

Page(from):

172

Page(to):

179

Pub. info.:

Bellingham, Wash.: SPIE - The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819437020 [0819437026]

Language:

English

Call no.:

P63600/4066

Type:

Conference Proceedings

Details

TDL ID:	ZA00017594
Series ID:	PA00000029
Conf. info. (Name):	Photomask and Next-Generation Lithography Mask Technology
Conf. info. (Number):	2000 : 7th
Conf. info. (Venue):	Yokohama, Japan
Conf. info. (Date):	2000.04.12-2000.04.13

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