WAFER BONDING FOR HYBRID CIRCUIT THCHNOLOGY USING SOLID-STATE REACTIONS

WAFER BONDING FOR HYBRID CIRCUIT THCHNOLOGY USING SOLID-STATE REACTIONS

Author(s):

Ma, Z.

Publication title:

Joining and adhesion of advanced inorganic materials : symposium held April 12-14, 1993, San Francisco, California, U.S.A.

Title of ser.:

Materials Research Society symposium proceedings

Ser. no.:

314

Pub. Year:

1993

Page(from):

241

Pub. info.:

Pittsburgh, PA: MRS - Materials Research Society

ISSN:

02729172

ISBN:

9781558992122 [155899212X]

Language:

English

Call no.:

M23500/314

Type:

Conference Proceedings

Details

TDL ID:	ZA00017536
Series ID:	PA00000011
Conf. info. (Name):	Symposium on joining and adhesion of advanced inorganic materials
Conf. info. (Number):	1993
Conf. info. (Venue):	San Francisco, CA, USA
Conf. info. (Date):	1993.04.12-1993.04.14

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