Thermal shift in the exciton absorption maxima as a function of the chip package design

Thermal shift in the exciton absorption maxima as a function of the chip package design

Author(s):

Publication title:

Optoelectronic Packaging

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

2691

Pub. Year:

1996

Page(from):

162

Page(to):

170

Pub. info.:

Bellingham, Wash.: SPIE-The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819420657 [0819420654]

Language:

English

Call no.:

P63600/2691

Type:

Conference Proceedings

Details

TDL ID:	ZA00017476
Series ID:	PA00000029
Conf. info. (Name):	Photonics West : Optoelectronic Packaging
Conf. info. (Number):	1996
Conf. info. (Venue):	San Jose, CA, USA
Conf. info. (Date):	1996.02.01-1996.02.02

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