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Fluxless Sn-Ag solder ball formation for flip-chip application

Author(s):
Publication title:
Optoelectronic Packaging
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
2691
Pub. Year:
1996
Page(from):
54
Page(to):
60
Pub. info.:
Bellingham, Wash.: SPIE-The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819420657 [0819420654]
Language:
English
Call no.:
P63600/2691
Type:
Conference Proceedings

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