Kinetics of the Bi Segregation at Grain Boundaries in Polycrystalline Cu

Kinetics of the Bi Segregation at Grain Boundaries in Polycrystalline Cu

Author(s):

Publication title:

Intergranular and interphase boundaries in materials : iib98 : proceedings of the 9th International Conference on Intergranular and Interphase Boundaries in Materials (iib98), held in Prague, Czech Republic, July, 1998

Title of ser.:

Materials science forum

Ser. no.:

294-296

Pub. Year:

1999

Page(from):

585

Page(to):

588

Pub. info.:

Zurich-Uetikon, Switzerland: Trans Tech Publications

ISSN:

02555476

ISBN:

9780878498239 [0878498230]

Language:

English

Call no.:

M23650

Type:

Conference Proceedings

Details

TDL ID:	ZA00017439
Series ID:	PA00000012
Conf. info. (Name):	International Conference,held in Prague
Conf. info. (Number):	9th
Conf. info. (Venue):	Prague, Czech Republic
Conf. info. (Date):	1998.07.00

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