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Stress-Voiding and Electromigration Failures in Narrow Metal Interconnects

Author(s):
Publication title:
Intergranular and interphase boundaries in materials : iib92 : proceedings of the 6th International Congress, Thessaloniki, Greece, June 21-26, 1992
Title of ser.:
Materials science forum
Ser. no.:
126-128
Pub. Year:
1993
Page(from):
351
Page(to):
354
Pub. info.:
Aedermannsdorf, Switzerland: Trans Tech Publications
ISSN:
02555476
ISBN:
9780878496600 [0878496602]
Language:
English
Call no.:
M23650
Type:
Conference Proceedings

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