Low-pressure aluminum planarization for sub-0.5-ｦﾌm via holes

Low-pressure aluminum planarization for sub-0.5-ｦﾌm via holes

Author(s):

Biberger,M.A. ( Varian Thin Film Systems )

Conci,D. ( Varian Thin Film Systems )

Lyons,J. ( Varian Thin Film Systems )

Rumer,M. ( Varian Thin Film Systems )

Tam,L. ( Varian Thin Film Systems )

Tkach,G. ( Varian Thin Film Systems )

Hoffman,V. ( Varian Thin Film Systems )

Martin,E.P. ( Lucent Technologies Bell Labs. )

Merchant,S.M.,Jr. ( Lucent Technologies Bell Labs. )

4 more

Publication title:

Multilevel Interconnect Technology

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

3214

Pub. Year:

1997

Page(from):

72

Page(to):

78

Pub. info.:

Bellingham, Wash.: SPIE-The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819425461 [081942546X]

Language:

English

Call no.:

P63600/3214

Type:

Conference Proceedings

Details

TDL ID:	ZA00017398
Series ID:	PA00000029
Conf. info. (Name):	Microelectronic Manufacturing : Multifevel Interconnect Technology
Conf. info. (Number):	1997
Conf. info. (Venue):	Austin, TX, USA
Conf. info. (Date):	1997.10.01-1997.10.02

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