Low-cost reliable transfer mold sensor packaging concept

Low-cost reliable transfer mold sensor packaging concept

Author(s):

Bossche,A. ( Delft Univ.of Technology (Netherlands) )
Cotofana,C.V.B. ( Delft Univ.of Technology (Netherlands) )
Kaldenberg,P. ( Eurasem B.V. (Netherlands) )
Van Dommelen,I. ( Eurasem B.V. (Netherlands) )
Mollinger,J.R. ( Deft Univ.of Technology (Netherlands) )

Publication title:

Micromachined Devices and Components III

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

3224

Pub. Year:

1997

Page(from):

153

Page(to):

160

Pub. info.:

Bellingham, Wash.: SPIE-The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819426567 [0819426563]

Language:

English

Call no.:

P63600/3224

Type:

Conference Proceedings

Details

TDL ID:	ZA00017397
Series ID:	PA00000029
Conf. info. (Name):	Micromachining and Microfabrication : Micromachined Devices and Components
Conf. info. (Number):	1997 : 3rd
Conf. info. (Venue):	Austin, TX, USA
Conf. info. (Date):	1997.09.29

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