High-density interconnect substrates and device packaging using conductive composites

High-density interconnect substrates and device packaging using conductive composites

Author(s):

Gandhi,P. ( Ormet Corp. )
Gallagher,C. ( Ormet Corp. )
Matijasevic,G. ( Ormet Corp. )

Publication title:

Design and manufacturing of WDM devices : 4-5 November 1997, Dallas, Texas

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

3234

Pub. Year:

1998

Page(from):

108

Page(to):

116

Pub. info.:

Bellingham, Wash., USA: SPIE-The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819426673 [0819426679]

Language:

English

Call no.:

P63600/3234

Type:

Conference Proceedings

Details

TDL ID:	ZA00017396
Series ID:	PA00000029
Conf. info. (Name):	Voice, Video, and Data Communications : Design and manufacturing of WDM devices
Conf. info. (Number):	1997
Conf. info. (Venue):	Dallas, TX, USA
Conf. info. (Date):	1997.11.04-1997.11.05

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