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Solder-bonded micromachined capacitive pressure sensors

Author(s):
  • Rogge,B. ( Swiss Federal Institute of Technology )
  • Moser,D. ( Micronas Semiconductor SA (Switzerland) )
  • Oppermann,H. ( FhG/IZM (Germany) )
  • Paul,O. ( Swiss Federal Institute of Technology )
  • Baltes,H. ( Swiss Federal Institute of Technology )
Publication title:
Micromachined Devices and Components IV
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
3514
Pub. Year:
1998
Page(from):
307
Page(to):
315
Pub. info.:
Bellingham, Wash.: SPIE-The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819429735 [0819429732]
Language:
English
Call no.:
P63600/3514
Type:
Conference Proceedings

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