Optoelectronic scalable substrates based on film/Z-connection and its application to film optical link module(FOLM)

Optoelectronic scalable substrates based on film/Z-connection and its application to film optical link module(FOLM)

Author(s):

Yoshimura,T. ( Fujitsu Computer Packaging Technologies,Inc )

Publication title:

Optoelectronic interconnects VII : photonics packaging and integrations II : 24-26 January 2000, San Jose, California

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

3952

Pub. Year:

2000

Page(from):

202

Page(to):

213

Pub. info.:

Bellingham, Wash.: SPIE - The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819435699 [0819435694]

Language:

English

Call no.:

P63600/3952

Type:

Conference Proceedings

Details

TDL ID:	ZA00017172
Series ID:	PA00000029
Conf. info. (Name):	Photonics West - Optoelectronic Materials and Devices : Optoelectronic interconnects ; Photonics packaging and integrations
Conf. info. (Number):	2000 : 7th ; 2nd
Conf. info. (Venue):	San Jose, CA, USA
Conf. info. (Date):	2000.01.24-2000.01.26

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