Novel method of predicting lot polish time for high-volume oxide chemical mechanical polishing
- Author(s):
- Schroeder,D.J. ( Motoroia,Inc )
- Buley,T.W.
- Chan,J.A.
- Publication title:
- Process, equipment, and materials control in integrated circuit manufacturing V : 22-23 September, 1999, Santa Clara, California
- Title of ser.:
- Proceedings of SPIE - the International Society for Optical Engineering
- Ser. no.:
- 3882
- Pub. Year:
- 1999
- Page(from):
- 66
- Page(to):
- 73
- Pub. info.:
- Bellingham, Wash.: SPIE - The International Society for Optical Engineering
- ISSN:
- 0277786X
- ISBN:
- 9780819434791 [0819434795]
- Language:
- English
- Call no.:
- P63600/3882
- Type:
- Conference Proceedings
Similar Items:
Electrochemical Society |
7
Conference Proceedings
"Surface treatments of indium tin oxide substrates: comprehensive investigation of mechanical, chemical, thermal, and plasma treatments"
SPIE-The International Society for Optical Engineering |
SPIE - The International Society for Optical Engineering |
8
Conference Proceedings
Characterization and reduction of copper chemical-mechanical-polishing-induced scratches
SPIE-The International Society for Optical Engineering |
3
Conference Proceedings
A Quantitative Model for Oxide Erosion in Chemical Mechanical Polishing of Tungsten
Electrochemical Society |
SPIE - The International Society for Optical Engineering |
Electrochemical Society |
10
Conference Proceedings
Wafer-scale modeling of pattern effect in oxide chemical mechanical polishing
SPIE-The International Society for Optical Engineering |
5
Conference Proceedings
Recent advances in endpoint and in-line monitoring techniques for chemical-mechanical polishing processes
SPIE-The International Society for Optical Engineering |
11
Conference Proceedings
Characterization of the Chemical Effects of Ceria Slurries for Chemical Mechanical Polishing
Materials Research Society |
SPIE - The International Society for Optical Engineering |
Society of Photo-optical Instrumentation Engineers |