Dry Etching of Through Substrate Via Holes for GaAs MMICs
- Author(s):
Agarawal,Vanita R. Rawal,D.S. Sharma,P.N. Naik,A.A. Sharma,H.S. Sehgal,B.K. Gulati,R. Vyas,H.P. - Publication title:
- Proceedings of the Tenth International Workshop on the Physics of Semiconductor Devices (December 14-18, 1999)
- Title of ser.:
- Proceedings of SPIE - the International Society for Optical Engineering
- Ser. no.:
- 3975
- Pub. Year:
- 2000
- Vol.:
- Part1
- Page(from):
- 637
- Page(to):
- 640
- Pub. info.:
- Bellingham, Wash.: SPIE - The International Society for Optical Engineering
- ISSN:
- 0277786X
- ISBN:
- 9780819436016 [0819436011]
- Language:
- English
- Call no.:
- P63600/3975
- Type:
- Conference Proceedings
Similar Items:
SPIE-The International Society for Optical Engineering |
SPIE-The International Society for Optical Engineering |
SPIE-The International Society for Optical Engineering |
SPIE-The International Society for Optical Engineering |
SPIE-The International Society for Optical Engineering |
SPIE-The International Society for Optical Engineering, Narosa |
4
Conference Proceedings
Characterisation of Ion Implanted Layers in GaAs and Influence of Various Parameters on Device Performance
Narosa Publishing House |
Narosa Publishing House |
SPIE-The International Society for Optical Engineering |
SPIE-The International Society for Optical Engineering, Narosa |
6
Conference Proceedings
Fabrication and Characterization of 200μm Deep, Dry Etched Via Holes for GaAs MMICs
SPIE-The International Society for Optical Engineering |
12
Conference Proceedings
Modified Citric Acid: Hydrogen Peroxide Etchant for Gate Recess Of GaAs/GaAlAs MODFETs
Narosa Publishing House |