THE EFFECT OF CURING ON THE THERMOMECHANICAL PROPERTIES OF BPDA-PDA POLYIMIDE THIN FILMS

THE EFFECT OF CURING ON THE THERMOMECHANICAL PROPERTIES OF BPDA-PDA POLYIMIDE THIN FILMS

Author(s):

Publication title:

Electronic packaging materials science VII : symposium held November 29-December 3, 1993, Boston, Massachusetts, U.S.A.

Title of ser.:

Materials Research Society symposium proceedings

Ser. no.:

323

Pub. Year:

1994

Page(from):

283

Pub. info.:

Pittsburgh, Pa.: MRS - Materials Research Society

ISSN:

02729172

ISBN:

9781558992221 [1558992227]

Language:

English

Call no.:

M23500/323

Type:

Conference Proceedings

Details

TDL ID:	ZA00017070
Series ID:	PA00000011
Conf. info. (Name):	Symposium on electronic packaging materials science
Conf. info. (Number):	7th
Conf. info. (Venue):	Boston, MA, USA
Conf. info. (Date):	1993.11.29-1993.12.03

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