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Cu Deposition Characteristics into Submicron Contact Holes Employing Self-Sputtering with a High Ionization Rate

Author(s):
Shingubara, S.
Sano, A.
Sakaue, H.
Takahagi, T.
Horiike, Y.
Radzimski, Z. J.
Posadowski, W. M.
2 more
Publication title:
Advanced metallization for future ULSI : symposium held April 8-11, 1996, San Francisco, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
427
Pub. Year:
1996
Page(from):
185
Pub. info.:
Pittsburgh, Pa.: MRS - Materials Research Society
ISSN:
02729172
ISBN:
9781558993303 [1558993304]
Language:
English
Call no.:
M23500/427
Type:
Conference Proceedings

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