Blank Cover Image

Atomic Structure of the Interfaces Between Silicon Directly Bonded Wafers

Author(s):
Benamara, M.
Rocher, A.
Laporte, A.
Sarrabayrouse, G.
Lescouzeres, L.
PeyreLavigne, A.
Fnaiech, M.
Claverie, A.
3 more
Publication title:
Defect and impurity engineered semiconductors and devices : symposium held April 17-21, 1995, San Francisco, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
378
Pub. Year:
1995
Page(from):
863
Pub. info.:
Pittsburgh, PA: MRS - Materials Research Society
ISSN:
02729172
ISBN:
9781558992818 [1558992812]
Language:
English
Call no.:
M23500/378
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings Direct Wafer Bonding of Preamorphized Silicon Wafers

Laporte, A., Sarrabayrouse, G., Benamara, M., Claverie, A., Rocher, A., Lescouzeres, L., PeyreLavigne, A.

MRS - Materials Research Society
7 Conference Proceedings INTERFACIAL STRUCTURE OF BONDED SILICON WAFERS

Reiche, M., Goesele, U., Tong, Q.-Y.

Electrochemical Society
2 Conference Proceedings Misoriention-Induced Defects at Bonded Si-Si Bonding Interfaces: Structural and Electrical Investigations

Laprote, A., Sarrabayrouse, G., Rocher, A., Lescouzeres, L., PeyreLavigne, A., Claverie, A.

Electrochemical Society
8 Conference Proceedings Photoluminescence Study of Interface Defects in Bonded Silicon Wafers

Nevin, W.A., Gay, D.L., Blackstone, S., Higgs, V.

Electrochemical Society
3 Conference Proceedings INFLUENCE OF THE WAFER CLEANING ON THE ELECTRICAL PROPERTIES OF Si-Si BONDED WAFERS

V. Macary, G. SarrabaYrouse, M. Bafleur, J.M. Reynes, A.P. Lavigne, A. Claverie

Electrochemical Society
9 Conference Proceedings STRUCTURE OF THE INTERFACE OF A BONDED WAFER

Y. Kawai, S. Ishigami, H. Furuya, T. Shmgyouji, Y. Saitoh

Electrochemical Society
4 Conference Proceedings Diffraction Studies of Bonded Silicon Interfaces

Benamara, M., Howes, P.B., Nielsen, M., Berg Rasmussen, F., Feidenhans'l, R., Hermansson, K., Grey, F.

Electrochemical Society
10 Conference Proceedings Si/SiC UHV direct wafer bonded interface structure

Kim, M. J., Xu, Hong, Liu, R.-J., Cox, M. J., Carpenter, R. W.

MRS-Materials Research Society
5 Conference Proceedings THE EARLY STAGE OF SILICON OXIDATION BY RAPID THERMAL PROCESSING: INFLUENCE OF SEVERAL PARAMETERS ON THE GROWTH KINETICS

Yahia-Messaoud, A., Sarrabayrouse, G., Claverie, A., Martinez, A., Scheid, E., Campo, E., faye, M.

Materials Research Society
11 Conference Proceedings Electrical Characterization of Bonded Unipolar Silicon Junctions

Vedde, J., Rasmussen, K., Viscor, P., Caraglia, C., Benamara, M.

Electrochemical Society
6 Conference Proceedings Interface Defects of Bonded Silicon Wafers

Reiche,M., Tong,Q.-Y., Gosele,U., Heydenreich,J.

Trans Tech Publications
12 Conference Proceedings CHARACTERIZATION OF DIRECTLY BONDED SILICON-ON-INSULATOR STRUCTURES USING SPECTROSCOPIC ELLIPSOMETRY

T. Saitoh, M.E. El-Ghazzawi, T. Oka, N. Natsuaki

Electrochemical Society
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12