Uncooled laser packaging based on silicon optical bench technology

Uncooled laser packaging based on silicon optical bench technology

Author(s):

Gates,J.V. ( AT&T Bell Labs. )

Publication title:

Laser Diode Chip and Packaging Technology

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

2610

Pub. Year:

1996

Page(from):

127

Page(to):

137

Pub. info.:

Bellingham, Wash.: SPIE-The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819419743 [0819419745]

Language:

English

Call no.:

P63600/2610

Type:

Conference Proceedings

Details

TDL ID:	ZA00017001
Series ID:	PA00000029
Conf. info. (Name):	Photonics East : Laser Diode Chip and Packaging Technology
Conf. info. (Number):	1995
Conf. info. (Venue):	Philadelphia, PA, USA
Conf. info. (Date):	1995.10.25-1995.10.26

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