Development of Multi-Chip Modules with Integrated Thin Film Passive Elements

Development of Multi-Chip Modules with Integrated Thin Film Passive Elements

Author(s):

Kim,N.P. ( Boeing Defense & Space Group )
Coates,K.L. ( Boeing Defense & Space Group )
Kunze,G.G. ( Boeing Defense & Space Group )
Chien,C.-P. ( Boeing Defense & Space Group )
Tanielian,M.H. ( Boeing Defense & Space Group )

Publication title:

Proceedings : 1997 International Symposium on Microelectronics : 14-16 October 1997, Pennsylvania Convention Center Philadelphia, Pennsylvania

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

3235

Pub. Year:

1997

Page(from):

157

Page(to):

163

Pub. info.:

Reston, VA: IMAPS

ISSN:

0277786X

ISBN:

9780930815509 [0930815505]

Language:

English

Call no.:

P63600/3235

Type:

Conference Proceedings

Details

TDL ID:	ZA00016929
Series ID:	PA00000029
Conf. info. (Name):	International Symposium on Microelectronics
Conf. info. (Number):	1997
Conf. info. (Venue):	Philadelphia, PA, USA
Conf. info. (Date):	1997.10.14-1997.10.16

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