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Reliability Evaluation of Underfill in Flip Chip Organic BGA Packages

Author(s):
Publication title:
Proceedings : 1997 International Symposium on Microelectronics : 14-16 October 1997, Pennsylvania Convention Center Philadelphia, Pennsylvania
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
3235
Pub. Year:
1997
Page(from):
124
Page(to):
125
Pub. info.:
Reston, VA: IMAPS
ISSN:
0277786X
ISBN:
9780930815509 [0930815505]
Language:
English
Call no.:
P63600/3235
Type:
Conference Proceedings

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