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Development of high-speed 3D inspection system for solder bumps

Author(s):
Nishiyama,Y. ( Fujitsu Labs. Ltd. (Japan) )
Tsukahara,H. ( Fujitsu Labs. Ltd. (Japan) )
Oshima,Y. ( Fujitsu Labs. Ltd. (Japan) )
Takahashi,F. ( Fujitsu Labs. Ltd. (Japan) )
Fuse,T. ( Fujitsu Labs. Ltd. (Japan) )
Nishino,T. ( Fujitsu Ltd. (Japan) )
1 more
Publication title:
Machine vision applications in industrial inspection VI : 27 January 1998, San Jose, California
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
3306
Pub. Year:
1998
Page(from):
60
Page(to):
67
Pub. info.:
Bellingham, Wash., USA: SPIE-The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819427465 [0819427462]
Language:
English
Call no.:
P63600/3306
Type:
Conference Proceedings

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