3D packaging technology for vision CMOS VLSI:review and performance evaluation

3D packaging technology for vision CMOS VLSI:review and performance evaluation

Author(s):

Bermak,A. ( Edith Cowan Univ. )
Bouzerdoum,A.
Eshraghian,K.

Publication title:

Electronics and structures for MEMS : 27-29 October, 1999, Royal Pines Resort, Queensland, Australia

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

3891

Pub. Year:

1999

Page(from):

248

Page(to):

256

Pub. info.:

Bellingham, Wash.: SPIE - The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819434920 [0819434922]

Language:

English

Call no.:

P63600/3891

Type:

Conference Proceedings

Details

TDL ID:	ZA00016695
Series ID:	PA00000029
Conf. info. (Name):	Smart Materials, Nano-, and Micro- Smart Systems : Electronics and structures for MEMS
Conf. info. (Number):	1999
Conf. info. (Venue):	Royal Pines Resort, Queensland, Australia
Conf. info. (Date):	1999.10.27-1999.10.29

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