Electrical Measurements of Microwave Flip-Chip Interconnections
- Author(s):
- Marks,Roger ( NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY )
- Jargon,J.A.
- Pao,C.K.
- Wen,C.P.
- Publication title:
- Proceedings : 1995 International Symposium on Microelectronics, October 24-26, 1995, Los Angels Convention Center, Los Angeles, California
- Title of ser.:
- Proceedings of SPIE - the International Society for Optical Engineering
- Ser. no.:
- 2649
- Pub. Year:
- 1995
- Page(from):
- 424
- Page(to):
- 429
- Pub. info.:
- Reston, VA: SPIE-The International Society for Optical Engineering
- ISSN:
- 0277786X
- ISBN:
- 9780930815448 [0930815440]
- Language:
- English
- Call no.:
- P63600/2649
- Type:
- Conference Proceedings
Similar Items:
SPIE-The International Society for Optical Engineering |
IMAPS |
SPIE-The International Society for Optical Engineering |
8
Conference Proceedings
Chip Scale Polymer Stud Grid Array Packaging and Reliability Based on Low Cost Flip Chip Processing
IMAPS, SPIE-The International Society for Optical |
IMAPS |
Electrochemical Society |
SPIE-The International Society for Optical Engineering |
IMAPS |
IMAPS |
Electrochemical Society |
Society of Photo-optical Instrumentation Engineers |
SPIE-The International Society for Optical Engineering |