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Flip Chip Interconnect:A Versitile Known Good Die Technology

Author(s):
Publication title:
Proceedings : 1995 International Symposium on Microelectronics, October 24-26, 1995, Los Angels Convention Center, Los Angeles, California
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
2649
Pub. Year:
1995
Page(from):
384
Page(to):
389
Pub. info.:
Reston, VA: SPIE-The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780930815448 [0930815440]
Language:
English
Call no.:
P63600/2649
Type:
Conference Proceedings

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