Advanced Flip-Chip Bonding Technique to Organic Substrate

Advanced Flip-Chip Bonding Technique to Organic Substrate

Author(s):

Bessho,Yoshihiro ( MATSUSHITA ELECTRIC INDUSTRIAL CO.,LTD. )

Publication title:

Proceedings : 1995 International Symposium on Microelectronics, October 24-26, 1995, Los Angels Convention Center, Los Angeles, California

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

2649

Pub. Year:

1995

Page(from):

359

Page(to):

364

Pub. info.:

Reston, VA: SPIE-The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780930815448 [0930815440]

Language:

English

Call no.:

P63600/2649

Type:

Conference Proceedings

Details

TDL ID:	ZA00016533
Series ID:	PA00000029
Conf. info. (Name):	International Symposium on Microelectronics
Conf. info. (Number):	1995
Conf. info. (Venue):	Los Angeles, CA, USA
Conf. info. (Date):	1995.10.24-1995.10.26

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