Excimer laser patterning of thick and thin films for high-density packaging(Invited Paper)

Excimer laser patterning of thick and thin films for high-density packaging(Invited Paper)

Author(s):

Rumsby,P.T. ( Exitech Ltd.(UK) )
Harve,E.C. ( Exitech Ltd.(UK) )
Thomas,D. ( Exitech Ltd.(UK) )
Rizvi,N.H. ( Exitech Ltd.(UK) )

Publication title:

Microelectronic Packaging and Laser Processing

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

3184

Pub. Year:

1997

Page(from):

176

Page(to):

185

Pub. info.:

Bellingham, Wash.: SPIE-The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819426116 [0819426113]

Language:

English

Call no.:

P63600/3184

Type:

Conference Proceedings

Details

TDL ID:	ZA00016463
Series ID:	PA00000029
Conf. info. (Name):	International Symposium on Microelectronics and Assembly : Microelectronic Packaging and Laser Processing
Conf. info. (Number):	1997
Conf. info. (Venue):	Singapore
Conf. info. (Date):	1997.06.25-1997.06.26

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